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M640 infrared thermal imaging module

Overview:

Infrared thermal imaging breaks through the visual barriers of natural physics and common things, and upgrades the visualization of things. It is a modern high-tech science and technology, which plays a positive and important role in the application of military activities, industrial production and other fields.


Product Details

1     Product Features

1. The product is small in size and easy to integrate;

2. FPC interface is adopted, which is rich in interfaces and easy to connect with other platforms;

3. Low power consumption;

4. High image quality;

5. Accurate temperature measurement;

6. standard data interface, support secondary development, easy integration, support access to a variety of intelligent processing platform.

♦ Product parameters

Type

M640

Resolution

640×480

Pixel space

17μm

 

55.7°×41.6°/6.8mm

 FOV/Focal length

 

 

28.4°x21.4°/13mm

* Paralles interface in 25Hz output mode;

FPS

25Hz

NETD

≤60mK@f#1.0

Working temperature

-15℃~+60℃

DC

3.8V-5.5V DC

Power

<300mW*  

Weight

<30g(13mm lens)

Dimension(mm)

26*26*26.4(13mm lens)

Data interface

parallel/USB  

Control interface

SPI/I2C/USB  

Image intensification

Multi-gear detail enhancement

Image calibration

The shutter correction

Palette

White glow/black hot/multiple pseudo-color plates

Measuring range

-20℃~+120℃(customized up to 550℃)

Accuracy

±3℃ or ±3%

Temperature correction

Manual /Automatic

Temperature statistics output

Real-time parallel output

Temperature measurement statistics

Support maximum /minimum statistics,temperature analysis

Infrared thermal imaging breaks through the visual barriers of natural physics and common things, and upgrades the visualization of things. It is a modern high-tech science and technology, which plays a positive and important role in the application of military activities, industrial production and other fields. It is a kind of equipment which uses infrared thermal imaging technology to transform the temperature distribution image of the object into visual image by detecting the infrared radiation of the object, signal processing, photoelectric conversion and other means.

This infrared thermal imaging design has developed from a bulky machine into a portable device for field test, which is easy to carry and collect. Fully considering the user's needs and environmental factors, the model is intuitive and concise, with business black as the main color and eye-catching yellow as the embellishment. It not only gives people the aesthetic feeling of high-end science and technology, but also highlights the strong and durable quality of the equipment, which is in line with the industry attribute of the equipment. Industrial grade three proofing design, exquisite surface treatment process, with good waterproof, dustproof, shockproof performance, suitable for all kinds of harsh industrial environment. The overall design is in line with ergonomics, intuitive man-machine interface, good hand-held grip, anti drop, passive non-contact detection and identification, more safe and simple operation.

In practical application, the hand-held infrared thermal imager is mainly used for industrial troubleshooting, which can quickly detect the temperature of the processing parts, so as to grasp the necessary information, and can quickly diagnose the faults of electronic devices such as motors and transistors. It can also be used to detect the bad contact with electrical equipment, as well as overheated mechanical parts, so as to prevent serious fires and accidents Accidents provide detection means and diagnostic tools for industrial production and many other aspects.

Infrared thermal imaging equipment can also be used as an effective fire alarm equipment. We know that in a large area of forest, hidden fires are often unable to be accurately judged by UAVs. Thermal imager can quickly and effectively detect these hidden fires, accurately determine the location and scope of the fire, and find the ignition point through smoke, so as to prevent and extinguish them as early as possible.

user interface description

1

Figure1 user interface

The product adopts 0.3Pitch 33Pin FPC connector (X03A10H33G), and the input voltage is:3.8-5.5VDC, undervoltage protection is not supported.

Form 1 interface pin of thermal imager

Pin number name type

Voltage 

Specification
1,2 VCC Power -- Power supply
3,4,12 GND Power --
5

USB_DM

I/O --

USB 2.0

DM
6

USB_DP

I/O -- DP
7

USBEN*

I -- USB enabled
8

SPI_SCK

I

 

 

 

 

Default:1.8V LVCMOS  ; (if need 3.3V

LVCOMS output, please contact us)

 

SPI

SCK
9

SPI_SDO

O SDO
10

SPI_SDI

I SDI
11

SPI_SS

I SS
13

DV_CLK

O

 

 

 

 

VIDEOl

CLK
14

DV_VS

O VS
15

DV_HS

O HS
16

DV_D0

O DATA0
17

DV_D1

O DATA1
18

DV_D2

O DATA2
19

DV_D3

O DATA3
20

DV_D4

O DATA4
21

DV_D5

O DATA5
22

DV_D6

O DATA6
23

DV_D7

O DATA7
24

DV_D8

O

DATA8

25

DV_D9

O

DATA9

26

DV_D10

O

DATA10

27

DV_D11

O

DATA11

28

DV_D12

O

DATA12

29

DV_D13

O

DATA13

30

DV_D14

O

DATA14

31

DV_D15

O

DATA15

32

I2C_SCL

I SCL
33

I2C_SDA

I/O

SDA

communication adopts UVC communication protocol, image format is YUV422, if you need USB communication development kit, please contact us;

in PCB design, parallel digital video signal suggested 50 Ω impedance control.

Form 2 Electrical specification

Format VIN =4V, TA = 25°C

Parameter Identify

Test condition

MIN    TYP    MAX

Unit
Input voltage range VIN --

3.8        4        5.5

V
Capacity ILOAD USBEN=GND

75      300

mA
USBEN=HIGH

110     340

mA

USB enabled control

USBEN-LOW --

0.4

V
USBEN- HIGN --

1.4               5.5V

V

Form 3 Absolute Maximum rating

Parameter Range
VIN to GND -0.3V to +6V
DP,DM to GND -0.3V to +6V
USBEN to GND -0.3V to 10V
SPI to GND -0.3V to +3.3V
VIDEO to GND -0.3V to +3.3V
I2C to GND -0.3V to +3.3V

Storage  temperature

−55°C to +120°C
      Operating  temperature −40°C to +85°C

Note: Ranges listed that meet or exceed absolute maximum ratings may cause permanent damage to the product.This is just a stress rating;Don't mean that the functional operation of the Product under these or any other conditions is higher than those described in the operations section of this specification. Prolonged operations that exceed maximum working conditions may affect the reliability of the product.

Digital interface output sequence diagram(T5)

Figure: 8bit Parallel image

M384

M640

M384

M640

Figure: 16bit Parallel image and temperature data

M384

M640

Attention

(1) It is recommended to use Clock rising edge sampling for data;

(2) Field synchronization and line synchronization are both highly effective;

(3) The image data format is YUV422, the data low bit is Y, and the high bit is U/V;

(4) The temperature data unit is (Kelvin (K) *10), and the actual temperature is read value /10-273.15 (℃).

Caution

To protect you and others from injury or to protect your device from damage, please read all of the following information before using your device.

1. Do not look directly at the high-intensity radiation sources such as the sun for the movement components;

2. Do not touch or use other objects to collide with the detector window;

3. Do not touch the equipment and cables with wet hands;

4. Do not bend or damage the connecting cables;

5. Do not scrub your equipment with diluents;

6. Do not unplug or plug other cables without disconnecting the power supply;

7. Do not connect the attached cable incorrectly to avoid damaging the equipment;

8. Please pay attention to prevent static electricity;

9. Please do not disassemble the equipment. If there is any fault, please contact our company for professional maintenance.

picture view

Mechnical interface dimension drawing

The shutter correction function can correct the non-uniformity of infrared image and the accuracy of temperature measurement.It takes 5-10min for the equipment to be stable during startup.The device starts the shutter by default and corrects for 3 times. After that, it defaults to no correction. The rear end can call the shutter regularly to correct the image and temperature data.


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