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M384 infrared thermal imaging module

short description:

Infrared thermal imaging breaks through the visual barriers of natural physics and common things, and upgrades the visualization of things. It is a modern high-tech science and technology, which plays a positive and important role in the application of military activities, industrial production and other fields.


Product Details

Thermal imaging module is based on ceramic packaging uncooled vanadium oxide infrared detector to develop a high performance infrared thermal imaging products, the products adopt parallel digital output interface, interface is rich, adaptive access a variety of intelligent processing platform, with high performance and low power consumption, small volume, easy to the characteristics of the development integration, can meet the application of various kinds of infrared measuring temperature of secondary development demand.

At present, the power industry is the most widely used industry of civil infrared thermal imaging equipment. As the most efficient and mature non-contact detection means, infrared thermal imager can greatly improve the progress of obtaining temperature or physical quantity, and further improve the operation reliability of power supply equipment. Infrared thermal imaging equipment plays a very important role in exploring the process of intelligence and super automation in the power industry.

Many inspection methods of surface defects of automobile parts are nondestructive testing method of coating chemicals. Therefore, the coated chemicals should be removed after inspection. Therefore, from the perspective of the improvement of the working environment and the health of the operators, it is required to use non-destructive testing methods without chemicals.

The following is a brief introduction of some chemical free nondestructive testing methods. These methods are to apply light, heat, ultrasonic, eddy current, current and other external excitation on the inspection object to change the temperature of the object, and use infrared thermal imager to carry out non-destructive inspection on the internal defects, cracks, internal peeling of the object, as well as welding, bonding, mosaic defects, density inhomogeneity and coating film thickness.

Infrared thermal imager nondestructive testing technology has the advantages of fast, non-destructive, non-contact, real-time, large area, remote detection and visualization. It is easy for practitioners to master the use method quickly. It has been widely used in mechanical manufacturing, metallurgy, aerospace, medical, petrochemical, electric power and other fields. With the development of computer technology, the intelligent monitoring and detection system of infrared thermal imager combined with computer has become a necessary conventional detection system in more and more fields.

Nondestructive testing is an applied technology subject based on modern science and technology. It is based on the premise of not destroying the physical characteristics and structure of the object to be tested. It uses physical methods to detect whether there are discontinuities (defects) in the interior or surface of the object, so as to judge whether the object to be tested is qualified, and then evaluate its practicability. At present, infrared thermal imager is based on non-contact, fast, and can measure the temperature of moving targets and micro targets. It can directly display the surface temperature field of objects with high temperature resolution (up to 0.01 ℃). It can use a variety of display methods, data storage and computer intelligent processing. It is mainly used in aerospace, metallurgy, machinery, petrochemical, machinery, architecture, natural forest protection and other fields Domain.

Product parameters

Type

M384

Resolution

384×288

Pixel space

17μm

 

93.0°×69.6°/4mm

 

 

 

55.7°×41.6°/6.8mm

 FOV/Focal length

 

 

28.4°x21.4°/13mm

* Paralles interface in 25Hz output mode;

FPS

25Hz

NETD

≤60mK@f#1.0

Working temperature

-15℃~+60℃

DC

3.8V-5.5V DC

Power

<300mW*  

Weight

<30g(13mm lens)

Dimension(mm)

26*26*26.4(13mm lens)

Data interface

parallel/USB  

Control interface

SPI/I2C/USB  

Image intensification

Multi-gear detail enhancement

Image calibration

The shutter correction

Palette

White glow/black hot/multiple pseudo-color plates

Measuring range

-20℃~+120℃(customized up to 550℃)

Accuracy

±3℃ or ±3%

Temperature correction

Manual /Automatic

Temperature statistics output

Real-time parallel output

Temperature measurement statistics

Support maximum /minimum statistics,temperature analysis

user interface description

1

Figure1 user interface

The product adopts 0.3Pitch 33Pin FPC connector (X03A10H33G), and the input voltage is:3.8-5.5VDC, undervoltage protection is not supported.

Form 1 interface pin of thermal imager

Pin number name type

Voltage 

Specification
1,2 VCC Power -- Power supply
3,4,12 GND Power --
5

USB_DM

I/O --

USB 2.0

DM
6

USB_DP

I/O -- DP
7

USBEN*

I -- USB enabled
8

SPI_SCK

I

 

 

 

 

Default:1.8V LVCMOS  ; (if need 3.3V

LVCOMS output, please contact us)

 

SPI

SCK
9

SPI_SDO

O SDO
10

SPI_SDI

I SDI
11

SPI_SS

I SS
13

DV_CLK

O

 

 

 

 

VIDEOl

CLK
14

DV_VS

O VS
15

DV_HS

O HS
16

DV_D0

O DATA0
17

DV_D1

O DATA1
18

DV_D2

O DATA2
19

DV_D3

O DATA3
20

DV_D4

O DATA4
21

DV_D5

O DATA5
22

DV_D6

O DATA6
23

DV_D7

O DATA7
24

DV_D8

O

DATA8

25

DV_D9

O

DATA9

26

DV_D10

O

DATA10

27

DV_D11

O

DATA11

28

DV_D12

O

DATA12

29

DV_D13

O

DATA13

30

DV_D14

O

DATA14

31

DV_D15

O

DATA15

32

I2C_SCL

I SCL
33

I2C_SDA

I/O

SDA

communication adopts UVC communication protocol, image format is YUV422, if you need USB communication development kit, please contact us;

in PCB design, parallel digital video signal suggested 50 Ω impedance control.

Form 2 Electrical specification

Format VIN =4V, TA = 25°C

Parameter Identify

Test condition

MIN    TYP    MAX

Unit
Input voltage range VIN --

3.8        4        5.5

V
Capacity ILOAD USBEN=GND

75      300

mA
USBEN=HIGH

110     340

mA

USB enabled control

USBEN-LOW --

0.4

V
USBEN- HIGN --

1.4               5.5V

V

Form 3 Absolute Maximum rating

Parameter Range
VIN to GND -0.3V to +6V
DP,DM to GND -0.3V to +6V
USBEN to GND -0.3V to 10V
SPI to GND -0.3V to +3.3V
VIDEO to GND -0.3V to +3.3V
I2C to GND -0.3V to +3.3V

Storage  temperature

−55°C to +120°C
      Operating  temperature −40°C to +85°C

Note: Ranges listed that meet or exceed absolute maximum ratings may cause permanent damage to the product.This is just a stress rating;Don't mean that the functional operation of the Product under these or any other conditions is higher than those described in the operations section of this specification. Prolonged operations that exceed maximum working conditions may affect the reliability of the product.

Digital interface output sequence diagram(T5)

Figure: 8bit Parallel image

M384

M640

M384

M640

Figure: 16bit Parallel image and temperature data

M384

M640

Attention

(1) It is recommended to use Clock rising edge sampling for data;

(2) Field synchronization and line synchronization are both highly effective;

(3) The image data format is YUV422, the data low bit is Y, and the high bit is U/V;

(4) The temperature data unit is (Kelvin (K) *10), and the actual temperature is read value /10-273.15 (℃).

Caution

To protect you and others from injury or to protect your device from damage, please read all of the following information before using your device.

1. Do not look directly at the high-intensity radiation sources such as the sun for the movement components;

2. Do not touch or use other objects to collide with the detector window;

3. Do not touch the equipment and cables with wet hands;

4. Do not bend or damage the connecting cables;

5. Do not scrub your equipment with diluents;

6. Do not unplug or plug other cables without disconnecting the power supply;

7. Do not connect the attached cable incorrectly to avoid damaging the equipment;

8. Please pay attention to prevent static electricity;

9. Please do not disassemble the equipment. If there is any fault, please contact our company for professional maintenance.

picture view

Mechnical interface dimension drawing


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