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DY-256C Thermal Imaging Module
◎ Small size, with the front lens of only (13 * 13 * 8) mm and the interface board of (23.5 * 15.3) mm
◎ Low power consumption up to 640mW;
◎ 256 x 192 infrared resolution provides high-definition thermal image;
◎ Equipped with USB interface board, it can be developed into different products;
◎ Split-type design is adopted for the lens and interface board, which are connected by FPC flat cable;
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DY-256M Thermal Imaging Module
This DY-256M thermal imaging module based on ceramic packaging uncooled vanadium oxide infrared detector to develop a high performance infrared thermal imaging products, the products adopt parallel digital output interface, adaptive access a variety of intelligent processing platform, with high performance and low power consumption, small volume, easy to the characteristics of the development integration, can meet the application of various kinds of infrared measuring temperature of secondary development demand.
