Thermal imaging cores M10-256 Split-type
♦ Overview
M10-256 split-type is a micro infrared thermal imaging module of the latest generation, with a very small size due to its high density integrated circuit design. The module adopts split-type design, the lens and interface board are connected by flat cable, plus a wafer-grade vanadium oxide detector with very low power consumption. The module is integrated with 3.2mm lens and shutter, equipped with USB interface board, so it can be developed into different devices. Control protocol or SDK is also provided for secondary development.
♦ Product Features
Small size, with the front lens of only (13 * 13 * 8) mm and the interface board of (23.5 * 15.3) mm
Low power consumption up to 640mW;
A resolution of 256 * 192 provides high-definition thermal image;
Equipped with USB interface board, it can be developed into different products;
Split-type design is adopted for the lens and interface board, which are connected by FPC flat cable;
Product specification | Parameters | Product specification | Parameters |
Type of detector | Vanadium oxide uncooled infrared focal plane | Resolution | 256* 192 |
Spectral range | 8-14um | Temperature measuring range | -15℃-600℃ |
Pixel spacing | 12um | Temperature measuring accuracy | ±2℃ or ±2% of the reading, whichever is greater |
NETD | <50mK @25℃ | Voltage | 5V |
Frame frequency | 25Hz | Lens parameters | 3.2mm F/1.1 |
Blank correction | Support | Focus mode | Fixed focus |
Working temperature | -10℃-75℃ | Interface board size | 23.5mm*x15.)mm |
Weight | <10g | Temperature calibration | Secondary calibration is provided |
Interface | USB |