Thermal Imaging Cores and Modules

DY-256C Thermal Imaging Module

◎ Small size with the front lens only (13 * 13 * 8) mm and the interface board of (23.5 * 15.3) mm

◎ 256 x 192 infrared resolution provides high-definition thermal image

◎ Equipped with USB interface board, it can be developed into different products

◎ Low power consumption only 640mW

◎ Split-type design for the lens and interface board, which are connected by FPC flat cable

Product Details

DY-256C is a micro infrared thermal imaging module of the latest generation, with a very small size due to its high density integrated circuit design.

It adopts split-type design, the lens and interface board are connected by flat cable, plus a wafer-grade vanadium oxide detector with very low power consumption.

The module is integrated with 3.2mm lens and shutter, equipped with USB interface board, so it can be developed into different devices.

Control protocol or SDK is also provided for secondary development.

Specification

Product specification	Parameters	Product specification	Parameters
Type of detector	Vanadium oxide uncooled infrared focal plane	Resolution	256* 192
Spectral range	8-14um	Temperature measuring range	-15℃-600℃
Pixel spacing	12um	Temperature measuring accuracy	±2℃ or ±2% of the reading, whichever is greater
NETD	＜50mK @25℃	Voltage	5V
Frame frequency	25Hz	Lens parameters	3.2mm F/1.1
Blank correction	Support	Focus mode	Fixed focus
Working temperature	-10℃-75℃	Interface board size	23.5mm*x15.)mm
Weight	<10g	Temperature calibration	Secondary calibration is provided
Interface	USB