DyMN Series Thermal Imaging Core

The DyMN-640/384 series uncooled thermal imaging core adopts the patented “Falcon” infrared thermal processing chip to replace the traditional FPGA solution, and own a new self-developed 12μm pixel WLP package detector, providing a parallel digital interface for convenient integration and development, and can be flexibly connected to various intelligent processing platforms. With high performance, small size, light weight, low power consumption and economic price, meeting the application requirements of SWaP3 (Size, Weight and Power, Performance, Price).